Perfect soldering quality with the new vacuum reflow oven
from REK Innovation GmbH
Welcome to the future of electronics manufacturing! Our vacuum reflow oven is the ideal solution for demanding soldering processes that require maximum precision and reliability.
Why our vacuum reflow oven?
✔ Void-free solder connections
Thanks to the latest technology, air pockets are effectively eliminated. The result? Perfect, stable solder joints that meet the highest quality standards.
✔ Precise temperature control
With our state-of-the-art control technology you have full control over the soldering process - ideal for sensitive components and complex components.
✔ Highest efficiency
Optimize your production processes with our energy-efficient oven. It reduces operating costs without compromising on quality.
✔ Flexible and versatile
Whether for power modules, power electronics or automotive applications – our oven is designed for a wide range of soldering requirements and offers maximum flexibility.
✔ Customizable Heating/Cooling
Allows both contact and contactless thermal processing, independent of chamber pressure or gas composition.
Technical highlights
- Vacuum level control for individual adaptation to your needs
- Outstanding temperature uniformity for optimal yield
- Integrated nitrogen and formic acid atmosphere for optimal soldering quality
- Advanced process control for consistent and repeatable results
- Robust design for high reliability and durability in continuous use
Optimize your production
Our vacuum reflow oven sets new standards in electronics production. Ensure maximum efficiency, process reliability and superior soldering quality that strengthens your competitive advantage.
Contact us today!
Learn more about our vacuum reflow technology and how it takes your production to the next level. Our experts are at your disposal – for tailor-made solutions that perfectly meet your requirements.
REK Innovation GmbH – technology that connects.