REK Innovation 开发和生产用于电子制造的设备
SC-350系列真空回流焊炉
用于工艺研发、中批量生产. 新颖的可扩展概念.德国制造
应用领域:
- 功率半导体封装
- DBC和AMB基板的大面积焊接
- 雷达TR模块
- 真空封装 (MEMS, 传感器)
激光二级管/大功率LED 封装
圆片级封装的凸点回流
焊膏工艺
我们在中国的销售和服务合作伙伴:
(Our sales and service partner in China)
Beijing Ningyuan Bona Electronics Technology Co., Ltd.
Room 1607, Building 2, Yard 2, Yinhe South Street
Beijing, Shi Jing Shan District
P.R. CHINA
sales{at}nybona-tec.com
Mob +86 15810207886
Micro-Power Scientific Co., Ltd.
Room 1111, Building 3, Noble Center, No.128, South 4th Ring Road West Road,, Fengtai District,
100070 Beijing, China
Contact Name: James Wang
Tel: +86-10-88 89 33 51/52/53
Mobile Phone: +86-1 39 01 37 70 12
Fax: +86-10-88 89 33 10
E-mail: jameswang{at}micropowergroup.com
Website: http://www.micropowergroup.com
我们在台湾的销售和服务合作伙伴: (Our sales and service partner in Taiwan) Sigma Technology Corp. 2F, No.130, Chin-Kuo Rd., Taoyuan City 33044, Taiwan, R.O.C puma.lin{at}sigmatekcorp.com Mob +886 975758071 |